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d a t a sh eet preliminary speci?cation 2002 aug 14 integrated circuits PCF8831 stn rgb - 160 output row driver
2002 aug 14 2 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 contents 1 features 2 applications 3 general description 4 ordering information 5 block diagram 6 pinning 7 functional description 7.1 row driver 7.2 80-bit shift register 7.3 row control 7.4 frame control 8 limiting values 9 handling 10 dc characteristics 11 ac characteristics 11.1 power-up and power-down sequences 12 application information 13 internal protection circuits 14 bonding pad location 15 tray information 16 data sheet status 17 definitions 18 disclaimers
2002 aug 14 3 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 1 features row driver for lcd dot matrix 160 row outputs selectable scan direction support of display off function support of n-line inversion programmable connection to display module logic supply voltage: 2.4 to 3.5 v display supply voltage range: 15 to 40 v low power consumption; suitable for battery operated systems cmos compatible inputs manufactured in silicon gate cmos process. 2 applications mobile phones personal digital assistant (pda) automotive information systems point-of-sale terminals instrumentation. 3 general description the PCF8831 is a row driver for driving colour stn displays. it is designed to operate with the pcf8832 column driver ic. 4 ordering information type number package name description version PCF8831u - chip with bumps in tray -
2002 aug 14 4 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 5 block diagram handbook, full pagewidth mgw629 row drivers shift register 1 row control sw1 svm v mh v h rp rclk v m v l fi 160 r0 to r159 PCF8831 t1 rowres2 t2 t3 t4 t5 sw2 r1f shift register 2 v ss v dd rowres1 . . . . . . . . . . fig.1 block diagram.
2002 aug 14 5 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 6 pinning note 1. dummy pads are located at positions 1 (slanted), 162 to 186 and 243 to 272. symbol pad (1) type description r159 to r0 2 to 161 o lcd row outputs rclk 187 i clock input to the shift register; data is transmitted with the positive clock edge; connect rclk to the rclk output of the pcf8832 column driver rp 188 i row pulse input; driven by the rp output of the pcf8832 column driver fi 189 i frame inversion input; controls frame and n-line inversion; fi is synchronized internally by the rising edge of rclk; fi can change only when rp changes; connect fi to the fi output of the pcf8832 column driver svm 190 i input that switches the non-selected level (v m or v ss , depending on r o wres2) to all row outputs; connect svm to the svm output of the pcf8832 column driver r o wres1 191 i external reset input 1; when low, the shift register is reset at the next rising edge of rclk and all outputs (r0 to r159) go to their non-selected level; connect r o wres1 to the resr o w output of the pcf8832 column driver r o wres2 192 i external reset input 2; when low, the non-selected level goes to v ss ; when high, the non-selected level goes to v m ; connect r o wrest to the resr o w output of the pcf8832 column driver r1f 193 i inputs r1f (row block 1 ?rst), sw1 (swap row block 1) and sw2 (swap row block 2) control the shift direction through the register and the order of the register; see table 1; connect to the corresponding signal outputs of the pcf8832 column driver, or connect directly to v dd or v ss as required by the display module configuration sw1 194 i sw2 195 i t1 to t5 196 to 200 i test inputs; connect to v ss for normal operation v ss 201 to 207 ps logic power supply, negative; normally connected to system ground v dd 208 to 214 ps logic power supply, positive; 2.4 to 3.5 v referred to v ss v m 215 to 221 ps mid-level lcd driving voltage; level is between v h and v l ; output at rows for non-selecting periods when r o wres2 is high; 1.25 to 2.0 v referred to v ss v mh 222 to 228 ps auxiliary supply voltage for row switch; higher than v m ; limited at v l +40v v h 229 to 235 ps high-level lcd driving voltage; top level of the positive selecting pulse of row outputs v l 236 to 242 ps low-level lcd driving voltage; bottom level of the negative selecting pulse of row outputs
2002 aug 14 6 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 7 functional description 7.1 row driver the row driver comprises high voltage outputs, level shifters and logic circuits. the row driver power supplies are: v h for the top level of selecting pulses v l for the bottom level of selecting pulses v m for the non-selecting level when rowres2 = high; the non-selecting level goes to v ss when rowres2 = low (active) v mh is an intermediate auxiliary supply v dd and v ss for the logic circuits. 7.2 80-bit shift register two shift registers of 80 bits each are contained in the PCF8831 row driver. with rowres1, the complete shift register will be reset at the next rising edge of rclk. the two shift registers can be configured for different applications by row control signals r1f, sw1 and sw2. 7.3 row control row control signals sw1, sw2 and r1f control the shift direction through the register and the order of the register (see fig.2). some switching combinations require the order of one or both shift registers to be swapped as shown by the example in fig.3. all row control combinations are shown in table 1, these can be software controlled when connected to the corresponding row control signals of the pcf8832 column driver. n dbook, full pagewidth mgw630 r0 sw1 r79 sw2 sw2 shift direction shift direction sw1 0 0 1 0 0 1 1 1 r1f shift register 1 lcd row outputs r80 sw1 r159 sw2 r1f shift register 2 lcd row outputs . . . . . . . . . . fig.2 shift directions; r1f = 1. handbook, full pagewidth mgw631 r79 sw1 r0 sw2 r1f shift register 1 lcd row outputs r159 sw1 r80 sw2 r1f shift register 2 lcd row outputs . . . . . . . . . . fig.3 row swapping; sw1 = sw2 = 1.
2002 aug 14 7 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 table 1 row control switching row control signals first register selected second register selected r1f sw1 sw2 1 0 0 r0 to r79 r80 to r159 1 0 1 r0 to r79 r159 to r80 1 1 0 r79 to r0 r80 to r159 1 1 1 r79 to r0 r159 to r80 0 0 0 r80 to r159 r0 to r79 0 0 1 r159 to r80 r0 to r79 0 1 0 r80 to r159 r79 to r0 0 1 1 r159 to r80 r79 to r0
2002 aug 14 8 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 7.4 frame control the signal fi controls frame inversion (fig.4) and n-line inversion (fig.5). software control of fi is performed via the pcf8832 column driver. mgw632 handbook, full pagewidth frame n frame n + 1 v h v l v m v h v l v m v h v l v m v h v l v m fi r0 r1 r2 r159 . . . . . . . . . . fig.4 frame inversion.
2002 aug 14 9 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 mgw633 handbook, full pagewidth v h v l v m v h v l v m v h v l v m v h v l v m v h v l v m v h v l v m fi r0 r1 r2 r5 r3 r4 fig.5 n-line inversion; n = 2.
2002 aug 14 10 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 8 limiting values in accordance with the absolute maximum rating system (iec 60134); note 1. note 1. parameters are valid over the operating temperature range; all voltages are referred to v l; substrate potential = v l ; unless otherwise specified. 9 handling inputs and outputs are protected against electrostatic discharge in normal handling. however, to be totally safe, it is recommended to take normal precautions appropriate to handling mos devices (see handling mos devices ). symbol parameter min. max. unit v dd logic supply positive voltage v ss - 0.3 v ss + 7.0 v v ss logic supply negative voltage v l - 0.3 v l + 40.0 v v mh auxiliary supply voltage for row switching v l - 0.3 v l + 45.0 v v h high-level lcd driving voltage v l - 0.3 v l +45 v v m mid-level lcd driving voltage v l - 0.3 v h + 0.3 v v h - 45.0 v l + 45.0 v v ss - 0.3 v ss + 7.0 v v i input voltage v ss - 0.3 v dd + 0.3 v t oper operating temperature - 40 +85 c t stg storage temperature - 65 +150 c
2002 aug 14 11 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 10 dc characteristics (v dd - v ss ) = 2.4 to 3.5 v; (v h - v l ) = 15 to 55 v; t amb = - 40 to +85 c; unless otherwise speci?ed. notes 1. the minimum level of (v mh - v m ) depends on (v m - v l ); a lower level of (v m - v l ) requires lower offset of v mh referred to v m . a higher level of (v mh - v m ) improves dynamic behaviour. a minimum level of (v mh - v m )=2.5v+0.2 (v m - v l ) should be maintained. 2. row outputs tested one at a time. 3. (v h - v l ) = 37 v; v mh =v h ; (v dd - v ss ) = 2.8 v; ; (v m - v ss ) = 1.47 v. 4. f rclk = 19.2 khz; svm = 0; rowres1 = rowres2 = high; single line mode; all row outputs open-circuit. 5. frame inversion frequency . symbol parameter conditions min. typ. max. unit v l low-level lcd driving voltage - 0 - v v h high-level lcd driving voltage v l + 15.0 - v l + 45.0 v v m mid-level lcd driving voltage v ss v dd v v mh auxiliary supply voltage for row switching note 1 v m +10 v l +40 v v ss logic supply negative voltage v m - 2.0 - v m - 1.25 v v dd logic supply positive voltage v ss + 2.4 - v ss + 3.5 v v ih high-level input voltage all inputs; referred to v ss v ss + 0.8 (v dd - v ss ) - v dd v v il low-level input voltage all inputs; referred to v ss v ss - v ss + 0.2 (v dd - v ss ) v i li input leakage current all inputs v i =v dd -- 5 m a v i =v ss - 5 --m a r o row output on-state resistance notes 2 and 3 i o = +100 m a - 600 tbf w i o = 100 m a - 600 tbf w i o = - 100 m a - 600 tbf w i dd current at pad v dd notes 3, 4 and 5 - 30 tbf m a i vh current at pad v h - 10 tbf m a i vmh current at pad v mh - 3 tbf m a i vm current at pad v m - 2 tbf m a i vl current at pad v l - 13 tbf m a v l v h + 2 -------------------- v m v h v l + 2 -------------------- = f fi f rclk 2 160 ------------------- =
2002 aug 14 12 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 11 ac characteristics (v dd - v ss ) = 2.4 to 3.5 v; (v h - v l ) = 15 to 55 v; t amb = - 40 to +85 c; see fig.6. symbol parameter min. typ. max. unit f rclk rclk clock frequency - 19.2 700 khz t rclkl rclk clock low time 100 -- ns t rclkh rclk clock high time 100 -- ns t r input rise time rclk, rp, fi, svm, r o wres1 and r o wres2 -- 50 ns t f input fall time rclk, rp, fi, svm, r o wres1 and r o wres2 -- 50 ns t su(d) data setup time rp, fi and r o wres1 50 -- ns t h(d) data hold time rp, fi and r o wres1 50 -- ns handbook, full pagewidth mgw634 rclk t r t su(d) t rclkl t rclkh t h(d) t f t r t f rp, fi, rowres1 fig.6 ac waveforms showing rclk and data input.
2002 aug 14 13 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 11.1 power-up and power-down sequences when the PCF8831 is powering-up or powering-down, the various supply voltages and some interface signals have to be applied in a certain sequence. table 2 power-up and power-down sequences t amb = - 40 to +85 c; refer to figs 7 and 8. notes 1. with no v h or v mh supply, both pads v h and v mh are clamped by separate internal diodes to v dd , see fig.10. 2. when no v l is supplied, pad v l is clamped to v ss by a separate internal diode, see fig.10. 3. when rowres2 is active (at v ss ), the level not-selected goes to v ss and pad v m can be disconnected. symbol parameter conditions min. unit t d(vdd-vh) delay v dd(on) to v h(on) note 1 0 ns t d(vdd-vmh) delay v dd(on) to v mh(on) note 1 0 ns t d(vdd-vl) delay v dd(on) to v l(on) note 2 0 ns t d(vh-vdd) delay v h(off) to v dd(off) note 1 0 ns t d(vmh-vdd) delay v mh(off) to v dd(off) note 1 0 ns t d(vl-vdd) delay v l(off) to v dd(off) note 2 0 ns t pu(vh-svm) power-up time v h(on) to svm inactive svm falls to v ss 0ns t pu(vmh-svm) power-up time v mh(on) to svm inactive svm falls to v ss 0ns t pu(vl-svm) power-up time v l(on) to svm inactive svm falls to v ss 0ns t rel(res1-svm) r o wres1 release time to svm inactive release r o wres1 before making svm inactive 0ns t rel(res1) r o wres1 release time allow at least one rising rclk edge before releasing r o wres1 50 ns t rel(res2) r o wres2 release time de?ne v m when r o wres2 is inactive; note 3 0ns t pd(vh) power-down time from svm active to v h(off) 0ns t pd(vmh) power-down time from svm active to v mh(off) 0ns t pd(vl) power-down time from svm active to v l(off) 0ns
2002 aug 14 14 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 mgw635 handbook, full pagewidth v ss v dd v dd v h v mh v m v l v h v l v m svm rclk t rel(res1) > v ss + 8 v > v ss + 8 v < v ss - 5.5 v v mh t d(vdd-vh) t pu(vh-svm) t rel(res1-svm) t pu(vmh-svm) t pu(vl-svm) (1) (1) (2) (3) t rel(res2) t d(vdd-vmh) t d(vdd-vl) rowres1 rowres2 fig.7 power-up sequence. (1) with no v h or v mh supply, both pads v h and v mh are clamped by separate internal diodes to v dd ; see table 2 and fig.10. (2) when no v l is supplied, pad v l is clamped to v ss by a separate internal diode; see table 2 and fig.10. (3) when rowres2 is active (at v ss ), the level not-selected goes to v ss and v m can be disconnected; see table 2 and fig.10.
2002 aug 14 15 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 mgw636 handbook, full pagewidth v ss v dd t d(vh-vdd) (1) (1) (2) (3) t pd(vh) t pd(vmh) t pd(vl) t rel(res2) t d(vmh-vdd) t d(vl-vdd) v dd v h v mh v m v l svm rowres2 fig.8 power-down sequence. (1) with no v h or v mh supply, both pads v h and v mh are clamped by separate internal diodes to v dd ; see table 2 and fig.10. (2) when no v l is supplied, pad v l is clamped to v ss by a separate internal diode; see table 2 and fig.10. (3) when rowres2 is active (at v ss ), the level not-selected goes to v ss and pad v m can be disconnected; see table 2 and fig.10.
2002 aug 14 16 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 12 application information handbook, full pagewidth mgw637 PCF8831 pcf8832 lcd display (128 160 dots) r0 r159 c0 ca2 ca1 c383 9 (2) 160 384 row control v m v col fbq lck v ss v ss v dd v dd v dd1 v dd3 v dd2 v m v h r2 r1 v mh v l t1 to t5 (1) v col lck fig.9 application example using PCF8831 with pcf8832. (1) test inputs t1 to t5 have to be tied to v ss . (2) row control signals are rclk, rp, fi, svm, resrow1, resrow2, sw1, sw2 and r1f.
2002 aug 14 17 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 13 internal protection circuits handbook, full pagewidth mgw639 v h v mh v dd v m v ss v l v ss v dd v l v h r0 to r159 pads 161 to 2 v dd pads 208 to 214 v ss pads 201 to 207 v h pads 229 to 235 v m pads 215 to 221 v mh pads 222 to 228 v l pads 236 to 242 rclk rp fi svm rowres1 rowres2 r1f sw1 sw2 t1 t2 t3 t4 t5 pad 187 188 189 190 191 192 193 194 195 196 197 198 199 200 fig.10 protection circuit diagrams. protection diode maximum forward current = 5 ma.
2002 aug 14 18 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 14 bonding pad information table 3 pad locations all x and y coordinates are referenced to the centre of the chip (dimensions in m m; see fig.13) symbol pad x y dummy (slanted) 1 - 6116.0 - 768.0 r159 2 - 5984.0 - 768.0 r158 3 - 5909.0 - 768.0 r157 4 - 5834.0 - 768.0 r156 5 - 5759.0 - 768.0 r155 6 - 5684.0 - 768.0 r154 7 - 5609.0 - 768.0 r153 8 - 5534.0 - 768.0 r152 9 - 5459.0 - 768.0 r151 10 - 5384.0 - 768.0 r150 11 - 5309.0 - 768.0 r149 12 - 5234.0 - 768.0 r148 13 - 5159.0 - 768.0 r147 14 - 5084.0 - 768.0 r146 15 - 5009.0 - 768.0 r145 16 - 4934.0 - 768.0 r144 17 - 4859.0 - 768.0 r143 18 - 4784.0 - 768.0 r142 19 - 4709.0 - 768.0 r141 20 - 4634.0 - 768.0 r140 21 - 4559.0 - 768.0 r139 22 - 4484.0 - 768.0 r138 23 - 4409.0 - 768.0 r137 24 - 4334.0 - 768.0 r136 25 - 4259.0 - 768.0 r135 26 - 4184.0 - 768.0 r134 27 - 4109.0 - 768.0 r133 28 - 4034.0 - 768.0 r132 29 - 3959.0 - 768.0 r131 30 - 3884.0 - 768.0 r130 31 - 3809.0 - 768.0 r129 32 - 3734.0 - 768.0 r128 33 - 3659.0 - 768.0 r127 34 - 3584.0 - 768.0 r126 35 - 3509.0 - 768.0 r125 36 - 3434.0 - 768.0 r124 37 - 3359.0 - 768.0 r123 38 - 3284.0 - 768.0 r122 39 - 3209.0 - 768.0 r121 40 - 3134.0 - 768.0 r120 41 - 3059.0 - 768.0 r119 42 - 2984.0 - 768.0 r118 43 - 2909.0 - 768.0 r117 44 - 2834.0 - 768.0 r116 45 - 2759.0 - 768.0 r115 46 - 2684.0 - 768.0 r114 47 - 2609.0 - 768.0 r113 48 - 2534.0 - 768.0 r112 49 - 2459.0 - 768.0 r111 50 - 2384.0 - 768.0 r110 51 - 2309.0 - 768.0 r109 52 - 2234.0 - 768.0 r108 53 - 2159.0 - 768.0 r107 54 - 2084.0 - 768.0 r106 55 - 2009.0 - 768.0 r105 56 - 1934.0 - 768.0 r104 57 - 1859.0 - 768.0 r103 58 - 1784.0 - 768.0 r102 59 - 1709.0 - 768.0 r101 60 - 1634.0 - 768.0 r100 61 - 1559.0 - 768.0 r99 62 - 1484.0 - 768.0 r98 63 - 1409.0 - 768.0 r97 64 - 1334.0 - 768.0 r96 65 - 1259.0 - 768.0 r95 66 - 1184.0 - 768.0 r94 67 - 1109.0 - 768.0 r93 68 - 1034.0 - 768.0 r92 69 - 959.0 - 768.0 r91 70 - 884.0 - 768.0 r90 71 - 809.0 - 768.0 r89 72 - 734.0 - 768.0 r88 73 - 659.0 - 768.0 r87 74 - 584.0 - 768.0 r86 75 - 509.0 - 768.0 r85 76 - 434.0 - 768.0 r84 77 - 359.0 - 768.0 symbol pad x y
2002 aug 14 19 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 r83 78 - 284.0 - 768.0 r82 79 - 209.0 - 768.0 r81 80 - 134.0 - 768.0 r80 81 - 59.0 - 768.0 r79 82 +91.0 - 768.0 r78 83 +166.0 - 768.0 r77 84 +241.0 - 768.0 r76 85 +316.0 - 768.0 r75 86 +391.0 - 768.0 r74 87 +466.0 - 768.0 r73 88 +541.0 - 768.0 r72 89 +616.0 - 768.0 r71 90 +691.0 - 768.0 r70 91 +766.0 - 768.0 r69 92 +841.0 - 768.0 r68 93 +916.0 - 768.0 r67 94 +991.0 - 768.0 r66 95 +1066.0 - 768.0 r65 96 +1141.0 - 768.0 r64 97 +1216.0 - 768.0 r63 98 +1291.0 - 768.0 r62 99 +1366.0 - 768.0 r61 100 +1441.0 - 768.0 r60 101 +1516.0 - 768.0 r59 102 +1591.0 - 768.0 r58 103 +1666.0 - 768.0 r57 104 +1741.0 - 768.0 r56 105 +1816.0 - 768.0 r55 106 +1891.0 - 768.0 r54 107 +1966.0 - 768.0 r53 108 +2041.0 - 768.0 r52 109 +2116.0 - 768.0 r51 110 +2191.0 - 768.0 r50 111 +2266.0 - 768.0 r49 112 +2341.0 - 768.0 r48 113 +2416.0 - 768.0 r47 114 +2491.0 - 768.0 r46 115 +2566.0 - 768.0 r45 116 +2641.0 - 768.0 r44 117 +2716.0 - 768.0 r43 118 +2791.0 - 768.0 symbol pad x y r42 119 +2866.0 - 768.0 r41 120 +2941.0 - 768.0 r40 121 +3016.0 - 768.0 r39 122 +3091.0 - 768.0 r38 123 +3166.0 - 768.0 r37 124 +3241.0 - 768.0 r36 125 +3316.0 - 768.0 r35 126 +3391.0 - 768.0 r34 127 +3466.0 - 768.0 r33 128 +3541.0 - 768.0 r32 129 +3616.0 - 768.0 r31 130 +3691.0 - 768.0 r30 131 +3766.0 - 768.0 r29 132 +3841.0 - 768.0 r28 133 +3916.0 - 768.0 r27 134 +3991.0 - 768.0 r26 135 +4066.0 - 768.0 r25 136 +4141.0 - 768.0 r24 137 +4216.0 - 768.0 r23 138 +4291.0 - 768.0 r22 139 +4366.0 - 768.0 r21 140 +4441.0 - 768.0 r20 141 +4516.0 - 768.0 r19 142 +4591.0 - 768.0 r18 143 +4666.0 - 768.0 r17 144 +4741.0 - 768.0 r16 145 +4816.0 - 768.0 r15 146 +4891.0 - 768.0 r14 147 +4966.0 - 768.0 r13 148 +5041.0 - 768.0 r12 149 +5116.0 - 768.0 r11 150 +5191.0 - 768.0 r10 151 +5266.0 - 768.0 r9 152 +5341.0 - 768.0 r8 153 +5416.0 - 768.0 r7 154 +5491.0 - 768.0 r6 155 +5566.0 - 768.0 r5 156 +5641.0 - 768.0 r4 157 +5716.0 - 768.0 r3 158 +5791.0 - 768.0 r2 159 +5866.0 - 768.0 symbol pad x y
2002 aug 14 20 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 r1 160 +5941.0 - 768.0 r0 161 +6016.0 - 768.0 dummy 162 +6155.0 - 768.0 dummy 163 6096.5 865.7 dummy 164 6021.5 865.7 dummy 165 5796.5 865.7 dummy 166 5721.5 865.7 dummy 167 5646.5 865.7 dummy 168 5571.5 865.7 dummy 169 5496.5 865.7 dummy 170 5421.5 865.7 dummy 171 5346.5 865.7 dummy 172 5271.5 865.7 dummy 173 5196.5 865.7 dummy 174 5121.5 865.7 dummy 175 5046.5 865.7 dummy 176 4971.5 865.7 dummy 177 4896.5 865.7 dummy 178 4821.5 865.7 dummy 179 4746.5 865.7 dummy 180 4671.5 865.7 dummy 181 4596.5 865.7 dummy 182 4521.5 865.7 dummy 183 4446.5 865.7 dummy 184 3921.5 865.7 dummy 185 3846.5 865.7 dummy 186 3771.5 865.7 rclk 187 3506.0 865.7 rp 188 3350.0 865.7 fi 189 3186.0 865.7 svm 190 3030.0 865.7 r o wres1 191 2866.0 865.7 r o wres2 192 2710.0 865.7 r1f 193 2546.0 865.7 sw1 194 2214.0 865.7 sw2 195 2050.0 865.7 t1 196 1894.0 865.7 t2 197 1730.0 865.7 t3 198 1574.0 865.7 t4 199 1410.0 865.7 t5 200 1254.0 865.7 symbol pad x y v ss 201 1139.0 865.7 v ss 202 1064.0 865.7 v ss 203 989.0 865.7 v ss 204 865.0 865.7 v ss 205 790.0 865.7 v ss 206 661.5 865.7 v ss 207 586.5 865.7 v dd 208 326.7 865.7 v dd 209 251.7 865.7 v dd 210 176.7 865.7 v dd 211 101.7 865.7 v dd 212 26.7 865.7 v dd 213 - 48.3 +865.7 v dd 214 - 123.3 +865.7 v m 215 - 882.9 +865.7 v m 216 - 957.9 +865.7 v m 217 - 1032.9 +865.7 v m 218 - 1107.9 +865.7 v m 219 - 1182.9 +865.7 v m 220 - 1257.9 +865.7 v m 221 - 1332.9 +865.7 v mh 222 - 1630.7 +865.7 v mh 223 - 1705.7 +865.7 v mh 224 - 1780.7 +865.7 v mh 225 - 1855.7 +865.7 v mh 226 - 1930.7 +865.7 v mh 227 - 2005.7 +865.7 v mh 228 - 2080.7 +865.7 v h 229 - 2334.3 +865.7 v h 230 - 2409.3 +865.7 v h 231 - 2484.3 +865.7 v h 232 - 2559.3 +865.7 v h 233 - 2634.3 +865.7 v h 234 - 2709.3 +865.7 v h 235 - 2784.3 +865.7 v l 236 - 3013.5 +865.7 v l 237 - 3088.5 +865.7 v l 238 - 3163.5 +865.7 v l 239 - 3238.5 +865.7 v l 240 - 3313.5 +865.7 v l 241 - 3388.5 +865.7 symbol pad x y
2002 aug 14 21 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 table 4 bonding pad dimensions v l 242 - 3463.5 +865.7 dummy 243 - 3728.5 +865.7 dummy 244 - 3803.5 +865.7 dummy 245 - 3878.5 +865.7 dummy 246 - 3953.5 +865.7 dummy 247 - 4103.5 +865.7 dummy 248 - 4178.5 +865.7 dummy 249 - 4253.5 +865.7 dummy 250 - 4328.5 +865.7 dummy 251 - 4403.5 +865.7 dummy 252 - 4478.5 +865.7 dummy 253 - 4553.5 +865.7 dummy 254 - 4628.5 +865.7 dummy 255 - 4703.5 +865.7 dummy 256 - 4778.5 +865.7 dummy 257 - 4853.5 +865.7 dummy 258 - 4928.5 +865.7 dummy 259 - 5003.5 +865.7 dummy 260 - 5078.5 +865.7 dummy 261 - 5153.5 +865.7 dummy 262 - 5228.5 +865.7 symbol pad x y dummy 263 - 5303.5 +865.7 dummy 264 - 5378.5 +865.7 dummy 265 - 5453.5 +865.7 dummy 266 - 5528.5 +865.7 dummy 267 - 5603.5 +865.7 dummy 268 - 5678.5 +865.7 dummy 269 - 5753.5 +865.7 dummy 270 - 5978.5 +865.7 dummy 271 - 6053.5 +865.7 dummy 272 - 6128.5 +865.7 alignment marks (see fig.12) alignment circle 1 5909.0 865.7 alignment circle 2 - 5866.0 +865.7 pad size unit minimum pad pitch 75 m m pad size; aluminium tbf m m bump dimensions 50 80 17.5 ( 5) m m wafer thickness (excluding bumps) 381 m m symbol pad x y handbook, halfpage mgw640 12.66 mm pitch 2.36 mm PCF8831 fig.11 bonding pads. mgs688 handbook, halfpage x centre y centre 100 m m fig.12 alignment mark detail.
2002 aug 14 22 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 handbook, full pagewidth mgw638 pc8831-1 x y 0, 0 . . . . . . . . . . . . . . . . . . . . pad 163 circle 2 r159 2.238 mm 12.66 mm dummy bump alignment mark pad 186 rclk rp fi svm rowres1 rowres2 r1f sw1 sw2 t1 t2 t3 t4 t5 v ss v dd v m v mh v h v l pad 243 pad 272 pad 1 pad 162 r79 r80 r0 circle 1 fig.13 bonding pad location. circles 1 and 2 are alignment marks (see fig.12).
2002 aug 14 23 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 15 tray information handbook, full pagewidth mgs488 d c a x y f e b fig.14 tray details. the dimensions are given in table 5. table 5 tray dimensions handbook, halfpage mgw641 PCF8831 fig.15 tray alignment. the orientation of the ic in a pocket is indicated by the position of the ic type name on the die surface with respect to the chamfer on the upper left corner of the tray. refer to the bonding pad location diagram for the orientation and position of the type name on the die surface. dimensions description value a pocket pitch, x direction 14.86 mm b pocket pitch, y direction 4.45 mm c pocket width, x direction 12.76 mm d pocket width, y direction 2.34 mm e tray width, x direction 50.8 mm f tray width, y direction 50.8 mm - number of pockets in x direction 3 - number of pockets in y direction 10
2002 aug 14 24 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 16 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. data sheet status (1) product status (2) definitions objective data development this data sheet contains data from the objective specification for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary specification. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product specification. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a. 17 definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 18 disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. bare die ? all die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of philips' delivery. if there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. there are no post packing tests performed on individual die or wafer. philips semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. accordingly, philips semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used.
2002 aug 14 25 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 notes
2002 aug 14 26 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 notes
2002 aug 14 27 philips semiconductors preliminary speci?cation stn rgb - 160 output row driver PCF8831 notes
? koninklijke philips electronics n.v. 2002 sca74 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 403512/01/pp 28 date of release: 2002 aug 14 document order number: 9397 750 09145

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